Existing Texas Semiconductor and AI Supply Chain Project Report
廠商據點 營運狀態 產業能力與合作執行方案
Company locations, operating status, industrial capabilities and a collaboration implementation plan
中英對照版 資料基準2026年10月11日
Information baseline: October 11, 2026
一 專案結論與使用方式
1 Findings and Use of This Report
德州已具備矽晶圓、設備、材料服務、IC設計、晶圓製造、AI系統及資料中心等產業基礎。專案可從既有營運企業的實際需求切入，優先驗證服務、培訓、備品及系統整合商機；本報告不是企業已同意合作或已釋出訂單的證明。
Texas already has a base across silicon wafers, equipment, materials services, IC design, wafer fabrication, AI systems and data centers. A project can begin with actual needs at existing businesses, validating service, training, spares and integration opportunities. This report does not establish company agreement or available contracts.
本報告選列可由公司及官方公開資料確認的代表性企業，提供城市、據點性質、已確認狀態與合作切入方式。名單不完整，也不對未公開的廠房產能、採購金額或供貨關係作推定。
This report selects representative businesses confirmed by company or official sources, showing cities, site types, established status and possible approaches. It is not exhaustive and does not infer undisclosed capacity, procurement values or supplier relationships.
主要合作區域為Austin及Round Rock周邊、Dallas至Sherman及Fort Worth的北德州聚落，以及Houston／Spring。San Antonio的Tower及Lubbock的X-FAB則提供特色製程及SiC能力，可用於功率與工業應用研究。[1–19]
Principal engagement areas are Austin and Round Rock, the North Texas cluster from Dallas to Sherman and Fort Worth, and Houston/Spring. Tower in San Antonio and X-FAB in Lubbock add specialty-process and SiC capabilities relevant to power and industrial applications. [1–19]
完整AI製造仍需逐項確認先進GPU晶圓、HBM、先進封裝、網路與冷卻的來源。現有德州據點名單，不能作為上述能力已全部本地化的證據。
A complete AI manufacturing chain still requires item-by-item verification of advanced GPU wafers, HBM, advanced packaging, networking and cooling sources. The existing Texas location list does not establish that all these capabilities are localized.
二 據點與營運狀態判定
2 Site and Operating Status Definitions
| 分類 Category | 本報告如何使用 Meaning |
| 既有製造 Manufacturing | 有晶圓、材料、設備或系統製造證據；不推定全產品線均在當地生產。 Evidence of wafer, material, equipment or system manufacturing; no inference that every product is made locally. |
| 總部研發服務 HQ R&D service | 有辦公、工程、研發或服務據點；不等同晶圓廠或系統組裝廠。 Office, engineering, R&D or service presence; not equivalent to a fab or assembly plant. |
| 資料中心 Data centers | 公開據點可確认；不推定GPU型號、付費客戶或空餘接電容量。 Publicly documented sites; no assumption about GPU models, paying customers or spare grid capacity. |
| 新增布局 New development | 公告或建設中的新增產線與園區另列；量產狀態須逐項核對。 Announced or developing lines and campuses are listed separately; production status must be checked individually. |
三 上游材料設備與製造服務名單
3 Upstream Materials Equipment and Manufacturing Services
| 廠商 Company | 城市 City | 已確認據點 Confirmed presence | 合作研究方向 Potential approach |
| GlobalWafers 環球晶 [1] | Sherman | GWA 300mm矽晶圓廠2025年5月開幕 300mm silicon wafer plant opened May 2025 |
材料品質 工廠服務與培訓 Material quality, facility services, training |
| Applied Materials [2] | Austin | 既有先進半導體設備製造園區 Existing advanced equipment manufacturing campus |
設備供應鏈 維修與技術訓練 Tool supply chain, service, technical training |
| Tokyo Electron [3] | Austin | 美國總部 設備研發 銷售服務 US HQ, equipment R&D, sales and service |
現場服務 工程人才及備品 Field service, engineering talent, spares |
| Entegris／POCO [4] | Burnet Decatur Round Rock | Burnet及Decatur材料製造；另有Round Rock據點 Materials manufacturing in Burnet/Decatur; Round Rock presence |
材料處理 品質及設備耗材 Material handling, quality, consumables |
| Photronics [5] | Allen | 光罩製造據點 Photomask manufacturing presence |
光罩品質 交付與製程銜接 Mask quality, delivery, process interface |
| KoMiCo [6] | Austin地區 | 零件清洗及塗層服務據點 Parts cleaning and coating site |
設備零件循環維護及物流 Parts refurbishment and logistics |
環球晶製造的是供晶片製造使用的矽晶圓，不是GPU晶片。TEL的Austin證據主要包括總部、研發及服務，因此本報告不將其全部設備製造能力歸入德州。Entegris與POCO按同一企業群呈現，避免重複計算。[1,3–4]
GlobalWafers produces silicon wafers used to manufacture chips, not GPU chips. TEL’s Austin evidence concerns headquarters, R&D and services, so this report does not assign all its equipment production to Texas. Entegris and POCO are presented as one corporate group to avoid double counting. [1,3–4]
上述服務對既有晶圓廠具有商業關聯，但列入名單不表示已獲Samsung、TI或其他企業認證。實際供貨仍需品質稽核、設備平台相容性、供應商資格及商業合約。
These services are commercially relevant to operating fabs, but listing does not establish qualification by Samsung, TI or another business. Supply requires quality audits, equipment compatibility, vendor qualification and contracts.
四 中游設計與晶圓製造名單
4 IC Design and Wafer Manufacturing
| 廠商 Company | 城市 City | 已確認據點 Confirmed presence | 能力與界限 Capability and boundary |
| Texas Instruments [7] | Dallas Richardson Sherman | 總部；RFAB1／2及SM1已生產 HQ; RFAB1/2 and SM1 in production |
類比及嵌入式；不等於先進GPU代工 Analog/embedded, not advanced GPU foundry |
| Samsung [8] | Austin | 既有晶圓製造基地；Taylor另列 Existing wafer manufacturing; Taylor separate |
邏輯晶片代工 Logic foundry |
| NXP [9] | Austin | ATMC及Oak Hill兩座晶圓廠；設計與美國總部 Two fabs, design and US HQ |
MCU 處理器 電源 RF 感測 MCUs, processors, power, RF, sensors |
| Tower Semiconductor [10] | San Antonio | Fab 9 200mm既有廠 Existing 200mm Fab 9 |
特色及類比代工 Specialty and analog foundry |
| X-FAB [11] | Lubbock | 既有150mm SiC製程基地 Existing 150mm SiC processing site |
SiC功率元件；非2nm邏輯 SiC power devices, not 2nm logic |
| AMD [12] | Austin | 重要營運與工程據點 Significant operations and engineering |
CPU GPU研發；非自有德州晶圓廠 CPU/GPU R&D, not an owned Texas fab |
| Silicon Labs [13] | Austin | 總部及IC業務據點 HQ and IC business presence |
無線與IoT設計 Wireless and IoT design |
| Cirrus Logic [14] | Austin | 總部 主要工程及行政據點 HQ, principal engineering and administration |
音訊及混合訊號設計 Audio and mixed-signal design |
TI確認Sherman SM1於2025年12月開始生產，但四座規畫廠不能全部算作已量產。NXP確認兩座Austin晶圓廠。不同製程應分開評估：類比、MCU、SiC、特色代工與先進邏輯的客戶、工具、材料及認證並不相同。[7,9–11]
TI confirms SM1 production began in December 2025; all four planned Sherman fabs must not be counted as operating. NXP confirms two Austin fabs. Analog, MCU, SiC, specialty foundry and advanced logic require separate assessments of customers, tools, materials and qualification. [7,9–11]
對IC教育專案，可分為設計驗證、設備廠務、材料品質、功率元件與製造營運等課程。課程應以企業職缺及操作任務驗證，不能只憑城市內有晶片公司便假設有委訓需求。
An IC education project can offer design verification, equipment/facilities, materials quality, power devices and manufacturing operations tracks. Curricula need validation against vacancies and operating tasks; local chip-company presence alone does not establish paid training demand.
五 下游系統與資料中心名單
5 Downstream Systems and Data Centers
| 廠商 Company | 城市 City | 已確認據點 Confirmed presence | 合作研究方向 Potential approach |
| Wistron 緯創 [15] | Fort Worth | D1於2026年7月開幕；公司公告已有GB300相關產品量產 D1 opened July 2026; reported GB300-related production |
AI系統測試 生產技能 維運 AI system testing, manufacturing skills, service |
| Dell Technologies [16] | Round Rock | 既有全球總部與營運 Existing global HQ and operations |
AI伺服器 整合 通路及服務 AI servers, integration, channels, services |
| HPE [17] | Spring | 既有公司總部 Existing corporate HQ |
企業運算 HPC 網路與系統 Enterprise compute, HPC, networks, systems |
| Google [18] | Midlothian | 既有資料中心園區；另有擴建 Existing data center campus; expansion separate |
算力設施運轉及能源需求 Compute-facility operations and energy needs |
| Digital Realty [19] | Dallas／DFW | 既有資料中心及互連設施 Existing data centers and interconnection |
機房 部署 維運與互連 Facilities, deployment, operations, interconnection |
緯創的公開資料支持AI系統組裝與測試在Fort Worth進行，不代表GPU裸晶或HBM在該廠製造。Dell與HPE本表的德州證據主要是總部與營運，也不能據此推定全部伺服器在德州生產。[15–17]
Wistron’s disclosures support AI system assembly and testing in Fort Worth, not GPU die or HBM fabrication at that plant. Texas evidence for Dell and HPE in this table concerns headquarters and operations; it does not establish local production of all servers. [15–17]
資料中心是系統與算力的使用端。合作應先核對其實際採購模式、租戶責任、設備所有權、服務窗口及供應商資格，不能將園區存在直接換算成GPU採購或租賃訂單。
Data centers are users of systems and compute. Engagement requires checks of procurement models, tenant responsibilities, equipment ownership, service contacts and vendor qualification. A campus location cannot be converted directly into GPU purchases or rental orders.
六 新增布局與未確認能力
6 New Developments and Unconfirmed Capabilities
| 項目 Item | 公開狀態 Public status | 專案處理 Treatment |
| Samsung Taylor [20] | 新增晶圓及研發布局；各產線進度須分開核對 New fabrication/R&D development; verify each line |
Austin列既有；Taylor不全部算已量產 Austin existing; do not count all Taylor lines as operating |
| Foxconn Houston [21] | NVIDIA確認AI系統工廠建設及新增產能布局 NVIDIA confirms AI-system factory development |
核對產線 驗收 投產及實際產品 Verify lines, acceptance, operation and products |
| HBM及先進封裝 | 本名單未證明完整本地製造能力 This directory does not prove complete local capability |
建立來源 認證及交付清單 Build a source, qualification and delivery register |
| TSMC德州晶圓廠 | 未列入本報告既有營運廠名單 Not counted as an existing operating fab here |
另案評估，不以假設投資作既有需求 Assess separately; do not use hypothetical investment as existing demand |
新工廠開始採購、安裝或測試，不等於已達穩定量產。即使企業已開幕，也應核對可交付產品、客戶認證、服務需求與擴產節奏，才能決定專案投入。
Procurement, installation or testing at a new factory does not establish stable production. Even after an opening, verify deliverable products, customer qualification, service needs and expansion timing before committing project resources.
七 區域合作策略
7 Regional Collaboration Strategy
| 區域 Region | 代表據點 Representative presence | 優先切入 Priority approach |
| Austin與Round Rock | Samsung NXP AMD Applied Materials TEL KoMiCo Dell | 設備服務 IC工程培訓 系統整合 Equipment service, IC engineering training, integration |
| 北德州 North Texas | TI GlobalWafers Photronics Wistron Google Digital Realty | 材料與電源 AI系統測試 AIDC維運 Materials/power, AI system testing, AIDC operations |
| Houston與Spring | HPE；Foxconn新增布局另查 HPE; Foxconn new development to verify |
企業AI系統 機櫃及服務能力 Enterprise AI systems, racks, service |
| San Antonio | Tower Semiconductor | 特色製程 品質與製造技能 Specialty processes, quality, manufacturing skills |
| Lubbock | X-FAB | SiC元件 功率應用與技術訓練 SiC devices, power applications, training |
建議第一階段以Austin及北德州作需求訪談，因兩地同時涵蓋多種環節，可比較不同客戶的服務及人才缺口。這是專案規畫建議，不是已確認的商機排名；是否優先投入仍取決於可接觸的採購窗口及付費需求。
Start requirements interviews in Austin and North Texas because both span several segments, allowing comparison of service and workforce gaps. This is a planning recommendation, not a verified opportunity ranking. Priority depends on accessible procurement contacts and paying demand.
八 AI Server AIDC與教育專案執行
8 AI Server AIDC and Education Project Execution
對AI Server與AIDC，可先研究設備驗收、系統測試、液冷與配電整合、備品及現場維運。對教育平台，可研究設備技術員、系統測試、廠務水電、品質與工安課程。每項均須由需求訪談確認，不預設廠商會採購。
For AI servers and AIDC, investigate acceptance testing, system validation, cooling and power integration, spares and field service. For an education platform, investigate equipment technicians, system testing, utilities, quality and safety training. Validate each through interviews rather than assuming purchases.
| 階段 Stage | 交付內容 Deliverables | 進入下一步條件 Gate |
| 0至30天 Days 0–30 | 確定目標法人及廠址 聯絡職能 訪談需求 Verify entity/site, contact functions, interview needs |
有具名需求人及可驗證工作範圍 Named requirement owner and verifiable scope |
| 31至60天 Days 31–60 | 技術資格 平台需求 報價範圍及成本 Technical qualification, platform needs, scope and cost |
確認預算 採購流程 驗收與付款 Budget, procurement, acceptance and payment |
| 61至90天 Days 61–90 | 小規模試行 培訓或服務示範 Small pilot, training or service demonstration |
書面核准及可衡量驗收標準 Written approval and measurable acceptance |
| 90天之後 After day 90 | 依合約交付 追蹤品質 留任及收款 Contract delivery, quality, retention and collection |
實際成效後再擴大 Expand after demonstrated results |
需求訪談應取得客戶法人、廠址、設備平台、服務邊界、技術資格、交付日期、採購窗口與付款責任。初期可先提供可審查的服務說明及課綱，待需求與預算確認後才建立專案報價。
Requirements interviews should capture the customer entity, site, equipment platform, service boundaries, qualifications, delivery dates, procurement contact and payment responsibility. Begin with reviewable service descriptions and curricula; price a project after needs and budgets are confirmed.
專案指標建議追蹤合格商機、完成資格審查、正式合約、驗收交付、毛利與收款；教育另看技能合格、錄用及留任。不要把寄出提案或名單數量當作收入成果。本文未設定缺乏依據的營收或回本目標。
Track qualified opportunities, qualification completion, contracts, accepted deliveries, margin and collection. For education, also track competency, hiring and retention. Proposals sent or names collected are not revenue outcomes. This report sets no unsupported revenue or payback targets.
九 風險與資料更新
9 Risks and Information Updates
| 風險 Risk | 處理方式 Response |
| 據點與能力混淆 Site/capability confusion | 保留法人 城市 據點類型及來源日期；由對方確認實際能力 Record entity, city, site type and source date; obtain company confirmation |
| 新產線進度變更 New-line changes | 按產線追蹤建設 驗收 客戶認證與量產 Track construction, acceptance, qualification and production by line |
| 供應商認證 Vendor qualification | 先確認資格及服務邊界，避免提前承諾交付 Confirm qualification and boundaries before delivery commitments |
| 需求未付費 Unfunded demand | 把預算 付款及正式採購程序納入決策 Include budget, payment and procurement in decisions |
| 多區服務成本 Regional service costs | 核算人員駐點 備品 交通與反應時間 Cost staffing, stock, travel and response time |
建議把本名單作為專案起始資料，每次正式接洽前更新法人、廠址及營運狀態。未在本報告確認的公司，可另列候選清單並補證據；未列名不代表其在德州沒有據點。
Use this directory as a starting point and update legal entities, sites and operating status before formal engagement. Unconfirmed companies can enter a candidate register pending evidence. Omission does not establish absence from Texas.
十 公開資料來源
10 Public Sources
下列公司與官方資料支持據點及營運狀態；合作方向、優先區域與90天工作流程是本報告建議。來源標號對應前文，頁面狀態以資料基準日為準。
Company and official sources below support locations and operating status. Collaboration directions, regional priorities and the 90-day sequence are recommendations. Numbers match the text; status is assessed at the baseline date.
[1] GlobalWafers America opening
https://www.sas-globalwafers.com/en/gwc_news_en_20250516/
[2] Applied Materials Austin manufacturing
https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-joins-apple-and-texas-instruments
[3] Tokyo Electron America locations
https://www.tel.com/about/locations/tea.html
[4] Entegris sites and manufacturing
https://www.entegris.com/en/home/about-us/locations.html
https://poco.entegris.com/en/home/about-us/locations.html
https://www.entegris.com/en/home/about-us/news/entegris-breaks-ground-on-expansion-in-burnet-texas.html
[5] Photronics locations
https://www.photronics.com/about-photronics/
[6] KoMiCo US location
https://www.komico.com/eng/html/company_location_02.php
[7] TI production sites
https://www.ti.com/about-ti/worldwide-manufacturing/sherman.html
https://www.ti.com/about-ti/worldwide-manufacturing/richardson.html
[8] Samsung existing Austin and expansion
https://www.nist.gov/chips/samsung-electronics-texas-austin
[9] NXP US sites
https://www.nxp.com/company/about-nxp/worldwide-locations/united-states:USA
[10] Tower manufacturing
https://towersemi.com/manufacturing/manufacturing-overview/
[11] X-FAB SiC manufacturing
https://www.xfab.com/technology/sic-gan
[12] AMD locations
https://www.amd.com/en/corporate/locations.html
[13] Silicon Labs headquarters
https://www.silabs.com/about-us/contact-us
[14] Cirrus Logic headquarters
https://www.cn.cirrus.com/company/contacts/
[15] Wistron Fort Worth D1 opening
https://www.wistron.com/en/Newsroom/2026-07-22
[16] Dell headquarters
https://investors.delltechnologies.com/company-information/faq
[17] HPE headquarters
https://www.hpe.com/us/en/legal/privacy.html
[18] Google Texas data centers
https://datacenters.google/locations/texas/
[19] Digital Realty Dallas
https://www.digitalrealty.com/data-centers/americas/dallas
[20] Samsung Taylor
https://semiconductor.samsung.com/sas/company/taylor/
[21] NVIDIA US AI manufacturing Foxconn and Wistron
https://www.nvidia.com/en-us/made-in-usa/