德州大學半導體產業教育報告
Texas University Semiconductor Industry Education Report
四條培訓路線 課程資源 產業銜接與合作執行方案
Four training pathways, academic resources, industry alignment and a collaboration implementation plan
資料基準2026年10月12日 合作規畫建議
Information baseline: October 12, 2026 | Collaboration planning recommendations
一 核心結論與報告範圍
1 Findings and Scope
德州已有可支援半導體人才培養的學位、學分證書、產業培訓及實作資源。建議以多校分工、企業出題、平台管理建立合作：IC設計與驗證、製程與材料、封裝與功率元件、設備技術員分別設定課程與驗收成果。
Texas has degree, academic certificate, industry training and practical resources for semiconductor workforce development. Build collaboration through specialized university roles, employer-defined projects and platform coordination, with separate curricula and outcomes for IC design and verification, processes and materials, packaging and power devices, and equipment technicians.
本報告涵蓋UT Austin、Texas A&M、UT Dallas、UNT、University of Houston、UT Arlington及Texas Tech七所大學，另納入Austin Community College（ACC）作技術員培訓伙伴。ACC屬社區學院，與研究型大學角色不同。
This report covers seven universities: UT Austin, Texas A&M, UT Dallas, UNT, University of Houston, UT Arlington and Texas Tech. Austin Community College (ACC) is included for technician training; its community-college role differs from that of research universities.
既有課程及資源以校方公開資料確認；合作排序、試行班、平台分工、L1至L5映射及執行時程均為本報告建議。本文未表示校方已接受合作，也未保證學分轉換、實習、就業或外部學員使用設備。
Existing courses and resources are grounded in university disclosures. Partner priorities, pilot cohorts, platform responsibilities, L1–L5 mapping and schedules are recommendations. The report does not establish school agreement or guarantee credit transfer, internships, employment or external access to facilities.
首輪宜先驗證三班：IC設計與驗證、製程與材料分析、設備技術員。封裝與功率元件另分兩個模組，取得合適師資、設備與企業題目後擴展。
Validate three initial cohorts: IC design and verification, process/materials analysis, and equipment technicians. Split packaging and power devices into two modules and expand after securing suitable instructors, resources and employer projects.
二 四條培訓路線與學校分工
2 Training Pathways and Partner Roles
| 路線 Pathway | 優先洽談 Priority partners | 建議成果 Proposed outcomes |
| IC設計與驗證 IC design and verification |
Texas A&M UT Arlington 進階 Advanced: UT Austin |
RTL 驗證計畫 測試除錯與可重跑成果 RTL, verification plans, testing/debugging, reproducible results |
| 製程與材料 Processes and materials |
UT Dallas UNT 補充 Additional: UT Austin Texas A&M |
製程 量測 材料分析 DOE與品質 Processes, measurement, materials, DOE, quality |
| 封裝與功率元件 Packaging and power devices |
Texas Tech UT Austin 補充 Additional: UNT UH |
封裝互連 熱可靠度 功率與保護 Interconnect, thermal reliability, power and protection |
| 設備技術員 Equipment technicians |
ACC 銜接 Progression: UT Austin TIE |
安全操作 保養 故障排除與交接 Safe operation, maintenance, troubleshooting, handover |
排序按已公開課程與合作切入方式提出，不是大學排名。正式選校仍需核對授課語言、招生資格、當期開課、設備名額、費用與課程是否允許企業或國際學員參與。
Priorities reflect documented curricula and proposed engagement routes, not university rankings. Selection still requires checks of language, admission, actual course availability, laboratory places, costs and eligibility for corporate or international participants.
三 學校資源與可合作內容
3 Institutional Resources and Collaboration Options
| 學校 Institution | 已確認課程資源 Confirmed resources | 建議合作 Proposed collaboration |
| UT Austin Austin [1–4] |
半導體碩士 線上製程元件證書 ASIC教學 TIE Semiconductor master’s, online process/device certificate, ASIC teaching, TIE |
工程師進修 ASIC課程及培訓體系銜接 Engineer upskilling, ASIC curricula, training progression |
| Texas A&M College Station [5–7] |
製造證書 製程安全證書 WAVE-CHIP驗證計畫 Manufacturing/safety certificates, WAVE-CHIP |
驗證專班 製造及安全課程 Verification, manufacturing and safety cohorts |
| UT Dallas Richardson [8] |
12學分半導體技術證書及材料製程課程 12-credit semiconductor technology certificate; materials/process courses |
材料 元件 量測與製程專題 Materials, devices, measurement and process projects |
| UNT Denton [9–10] |
9學分製造工程證書 CMEE實作資源 9-credit manufacturing certificate, CMEE resources |
製造分析 封裝與實驗課程 Manufacturing analysis, packaging and labs |
| University of Houston Houston [11] |
9學分工程製造證書，可選功率 熱管理 VLSI等 9-credit certificate; power, thermal, VLSI options |
熱與功率整合及區域進修 Thermal/power integration and regional upskilling |
| UT Arlington Arlington [12–13] |
9學分FPGA／SoC證書；VLSI及矽光子課程 9-credit FPGA/SoC certificate; VLSI/photonics courses |
數位設計 原型及系統整合 Digital design, prototyping, integration |
| Texas Tech Lubbock [14] |
3D異質整合碩士方向與人才培育資源 3DHI master’s pathway and workforce resources |
異質整合 封裝可靠度專題 Heterogeneous integration and reliability projects |
| ACC Austin [15–16] |
STARS技術員升級與企業客製培訓 STARS technician upskilling and corporate training |
設備技術員及培訓講師 Equipment technicians and instructor development |
研究所證書是學分課程，通常須符合學校入學及修課要求；企業短課、共同結訓證明與學位是不同交付。既有學分課不能直接改稱平台聯名證書，須由校方書面確認。
Graduate certificates are academic programs generally subject to admission and course requirements. Corporate short courses, joint completion credentials and degrees are distinct deliverables. Existing academic courses cannot simply become platform co-branded certificates without school authorization.
四 IC設計與驗證合作方案
4 IC Design and Verification Collaboration
Texas A&M的WAVE-CHIP聚焦硬體功能與安全驗證、模擬加速及AI／ML相關驗證教學。UT Arlington的FPGA／SoC證書包含SoC設計、進階數位邏輯及RISC處理器設計；UT Austin已有ASIC人才培育教學。這些資源可分別支援驗證、原型與ASIC課程。[3,5,12]
Texas A&M’s WAVE-CHIP focuses on functional/security verification, emulation and AI/ML-related verification teaching. UT Arlington’s FPGA/SoC certificate includes SoC, advanced digital logic and RISC processor design; UT Austin has ASIC workforce teaching. These provide distinct foundations for verification, prototyping and ASIC curricula. [3,5,12]
| 建議模組 Proposed module | 內容 Content | 驗收成果 Assessment |
| 基礎 Foundation | 同步邏輯 HDL 規格與介面 Synchronous logic, HDL, specifications/interfaces |
規格及可模擬設計 Specifications and simulatable design |
| 實作 Implementation | RTL Lint 時鐘 Reset與邊界 RTL, lint, clocks, reset, boundaries |
RTL與檢查紀錄 RTL and check records |
| 驗證 Verification | Testbench Assertions Coverage Regression Testbench, assertions, coverage, regression |
驗證計畫及可重跑測試 Verification plan and repeatable tests |
| 除錯 Debugging | Bug重現 根因與修改後驗證 Reproduction, root cause, post-fix tests |
Bug報告與關閉證據 Bug report and closure evidence |
| 專題 Project | FIFO 控制器或簡化加速器 FIFO, controller or simplified accelerator |
成果審查與交付包 Review and delivery package |
可提出12至16週非學分試行班，時數與課程由校方協商。對照L1，以Spec符合、Lint達標、Regression通過、無未處理critical warning及Code Review完成作DoD。初期採FPGA或模擬專題，投片另案核准。
Propose a 12–16-week non-credit pilot, with workload and syllabus negotiated with the institution. For L1, use specification compliance, satisfactory lint, passing regression, no unresolved critical warnings and completed code review as the definition of done. Start with FPGA or simulation; treat tape-out as a separate approved project.
洽談前須確認EDA授權可用人群、遠端操作、PDK範圍及專題IP。基礎課可使用允許教學的工具與資料；商用先進製程設計須另取得合適權限。
Confirm EDA license users, remote access, PDK scope and project IP. Foundational courses can use tools and data authorized for teaching; commercial advanced-node design needs separate access arrangements.
五 製程與材料合作方案
5 Process and Materials Collaboration
UT Dallas證書涵蓋電子材料與元件，選修包括製程、微影、材料分析及元件量測。UNT的製造工程證書可選IC製造、DOE及封裝等課；其50小時製程微證書限已修讀PHYS 4520的UNT學生，不能當作外部自由報名課。[8–10]
UT Dallas covers electronic materials and devices, with electives in processing, lithography, characterization and measurement. UNT offers fabrication, DOE and packaging options. UNT’s 50-hour device-processing microcredential is restricted to students enrolled in PHYS 4520; it is not an unrestricted external short course. [8–10]
UT Austin線上證書由SSE 380半導體導論、SSE 381製程、SSE 382元件三門課組成，通常跨三學期完成。Texas A&M製造證書必修包括ECEN 671固態元件及ECEN 688 IC／MEMS／感測器製造。[2,6]
UT Austin’s online certificate comprises SSE 380 Introduction to Semiconductors, SSE 381 Semiconductor Processes and SSE 382 Semiconductor Devices, typically across three semesters. Texas A&M’s manufacturing certificate requires ECEN 671 Solid State Devices and ECEN 688 IC, MEMS and Sensor Fabrication. [2,6]
| 能力 Capability | 建議教學 Teaching | 交付成果 Deliverable |
| 流程 Process flow | 薄膜 微影 蝕刻 清洗及污染控制 Films, lithography, etch, cleaning, contamination |
流程圖與風險分析 Flow and risk analysis |
| 材料 Materials | 材料特性 缺陷與分析方法 Properties, defects, analytical methods |
材料與缺陷報告 Materials/defect report |
| 量測 Measurement | 元件量測 資料品質與異常 Device measurement, data quality, anomalies |
量測分析與判讀 Measurement analysis |
| 改善 Improvement | SPC DOE與品質方法 SPC, DOE, quality methods |
實驗計畫與改善證據 Experiment plan and improvement evidence |
教學交付需分清線上理論、校內實驗與企業現場三種活動。修課不自動取得量產設備操作資格；校內實驗也需確認設備範圍、名額、安全訓練與授課責任。
Separate online theory, campus laboratory work and employer-site activities. Coursework does not automatically qualify someone to operate production tools. Campus labs require defined equipment scope, places, safety training and teaching responsibility.
六 封裝與功率元件合作方案
6 Packaging and Power Device Collaboration
封裝與功率元件應分模組：封裝重點為互連、材料、熱機械與可靠度；功率重點為元件、損耗、驅動、保護與散熱。跨模組專題再整合供電、封裝及冷卻。
Separate packaging from power devices: packaging emphasizes interconnect, materials, thermomechanics and reliability; power emphasizes devices, losses, driving, protection and cooling. Cross-module projects can then integrate power delivery, packaging and cooling.
| 模組 Module | 公開資源 Public foundation | 建議專題 Proposed project |
| 3D與異質整合 3D/heterogeneous integration |
Texas Tech 3DHI碩士方向 [14] Texas Tech 3DHI master’s pathway |
Chiplet架構 互連及整合流程 Chiplet architecture, interconnect, integration |
| 封裝與可靠度 Packaging/reliability |
UNT MTSE 5530 IC Packaging [9] | 熱應力 失效與可靠度計畫 Thermal stress, failure, reliability plan |
| 功率元件與封裝 Power devices/packaging |
UT Austin SPEC SiC GaN等研究 [17] SPEC research in SiC, GaN and related materials |
元件選型 損耗及功率封裝 Device selection, losses, power packaging |
| 熱與功率系統 Thermal/power systems |
UH熱管理及ECE 6305等選修 [11] UH thermal and power-electronics electives |
電源散熱整合工程分析 Power/cooling integration analysis |
對SiC、CPO及AI Server方向，可提出2.5D／3D方案比較、寬能隙元件選型及供電冷卻整合題目。這些為合作教學建議；研究團隊是否提供外部委訓、測試樣品或設備服務須另洽談。
For SiC, CPO and AI server work, propose 2.5D/3D comparisons, wide-bandgap device selection and power/cooling integration. These are teaching proposals; external training, test samples and equipment services require agreement with the research team.
HBM、CoWoS、Hybrid Bonding及CPO實作應逐項確認，不可由一般封裝課推定全部具備。結訓可採封裝架構、熱分析、損耗估算與可靠度計畫，並記錄模型假設及實驗驗證範圍。
Verify HBM, CoWoS, hybrid bonding and CPO practice individually; general packaging courses do not establish all those capabilities. Assess architecture, thermal analysis, loss estimates and reliability plans, documenting model assumptions and experimental validation scope.
七 設備技術員合作方案
7 Equipment Technician Collaboration
ACC的STARS是既有技術員升級課程，與區域半導體產業共同發展，並用於Samsung、NXP、Applied Materials、Infineon、TEL及TIE等員工培訓。ACC、UT Austin與TIE也已公告培訓中心合作基礎。[4,15]
ACC’s STARS is an existing technician upskilling program developed with regional industry and used for employees of Samsung, NXP, Applied Materials, Infineon, TEL and TIE. ACC, UT Austin and TIE have also announced a joint training-center initiative. [4,15]
| 技能 Skill | 建議驗收 Proposed assessment |
| 無塵室及安全 Cleanroom/safety | 穿戴 污染控制 安全檢核及異常處理 Gowning, contamination control, safety and incident handling |
| 電子與自動化 Electronics/automation | 量測 接線 感測器 氣動及自動化任務 Measurement, wiring, sensors, pneumatics, automation tasks |
| 保養 Maintenance | 按程序完成保養與設備紀錄 Procedural maintenance and equipment records |
| 故障排除 Troubleshooting | 定位故障 處理及按規則升級 Locate, resolve and escalate faults appropriately |
| 工作交接 Handover | 工單 操作紀錄及交接完整性 Work orders, operating logs and complete handover |
平台可提供中英教材、預習、測驗及學習追蹤；實機課、安全監督與操作合格判定由具備設備及責任的伙伴執行。設備技術員應有獨立職能階梯，不直接套用IC設計L1至L5。
The platform can provide bilingual materials, preparation, tests and learning records. A partner with equipment and operating responsibility should deliver practical instruction, safety supervision and competency sign-off. Technicians need a separate skills ladder from IC design L1–L5.
八 平台與學校企業分工
8 Platform University and Employer Responsibilities
| 角色 Role | 建議責任 Proposed responsibilities |
| 教育平台 Platform | 招生 前測 基礎教材 LMS AI Tutor及紀錄 Recruitment, entry tests, foundation content, LMS, AI tutor, records |
| 學校 Institution | 課程 師資 實驗安排 評量及核准證書 Curriculum, faculty, labs, assessment, authorized credentials |
| 企業 Employer | 職缺技能 題目 導師及工作表現回饋 Job skills, projects, mentors, workplace feedback |
| 共同管理 Joint governance | 課程品質 預算 變更及驗收 Quality, budget, change control and acceptance |
AI Tutor可協助解釋、練習及學習診斷，但安全操作、工程成果與證書資格須由授權人員審核。平台培訓時數與大學學分也須分開記錄，只有校方核准後才可表述為可轉換學分。
An AI tutor can support explanations, practice and learning diagnostics; authorized personnel must review safety, engineering outcomes and credential eligibility. Record platform training hours separately from university credits, describing credit transfer only after institutional approval.
| 層級 Level | 建議能力 Proposed capability | 合作方式 Collaboration |
| L1 | 依規格完成任務與可查核成果 Specified tasks with auditable outputs |
基礎課 實作 DoD Foundation, practice, DoD |
| L2 | 獨立模組或工程分析 Independent module or analysis |
進階課 完整專題 Advanced courses/projects |
| L3 | 跨模組或系統問題 Cross-module/system problems |
整合案例 企業題目 Integration and employer projects |
| L4 | NPI 資格驗證 風險與交付 NPI, qualification, risks, delivery |
產業導師 專案審查 Industry mentors/reviews |
| L5 | 架構 技術路線與組織能力 Architecture, roadmap, capability |
長期產學與研究 Long-term industry research |
此映射是平台建議分級，不是美國大學官方職級。L4與L5需要實際專案責任及交付證據，不能單靠修課與筆試認定。
This is a proposed platform framework, not an official US university job classification. L4 and L5 require evidence of real project responsibility and delivery, beyond courses and written tests.
九 合作時程費用與成效
9 Schedule Costs and Outcomes
| 階段 Stage | 交付與決策 Deliverables and decisions |
| 前30天 First 30 days | 完成技能需求 課程對照及學校窗口 Skills requirements, course mapping, institutional contacts |
| 31至60天 Days 31–60 | 取得課綱 師資 費用 設備與招生方案 Syllabus, instructors, costs, labs, admission plan |
| 61至90天 Days 61–90 | 核准試行班 合約 評量與證書形式 Approve pilot, contract, assessment and credential form |
| 試行之後 After pilot | 檢查技能 企業回饋與成本後擴班 Expand after skill, employer-feedback and cost review |
上述是建議洽談節奏，非校方開課承諾。學分課須配合學期與錄取時程；外部短課須確認最低班級規模、師資與場地。學校已設有課程，不表示隨時可提供企業客製班。
This is a proposed negotiation sequence, not a course-start commitment. Academic programs follow semesters and admission calendars; external courses require minimum cohort, instructors and venues. An existing course does not establish immediate availability for a customized corporate cohort.
預算應分列課程與授課、EDA／雲端、實驗與耗材、平台內容、翻譯、差旅與專案管理。每名合格學員成本以總成本除以實際通過人數計算；尚未取得報價前不設定營收、毛利或回本保證。
Separate curriculum/teaching, EDA/cloud, labs/consumables, platform content, translation, travel and management costs. Cost per competent graduate equals total cost divided by actual passers. Do not set revenue, margin or payback guarantees before obtaining quotations.
| 指標 Metric | 建議定義 Proposed definition |
| 技能合格 Competency | 依共同rubric通過者占完成評量者 Passers under a joint rubric divided by assessed learners |
| 專題交付 Project delivery | 合格且完整的可重現交付包 Accepted, complete and reproducible packages |
| 企業成果 Employer outcome | 職務錄用 內部技能認證或工作改善分別追蹤 Track hiring, internal qualification and work improvements separately |
| 留任與成本 Retention/cost | 在約定期間追蹤留任及合格學員成本 Track retention and graduate cost over agreed periods |
合約應寫明教材IP、錄影翻譯、校名Logo、學員資料、實驗責任、工具權限、評量及證書核發。優先交付可審查課程與專題成果，再評估學分或雙聯學位。
Agreements should define content IP, recording/translation, university marks, learner data, lab responsibilities, tool access, assessment and credential issuance. Validate reviewable curricula and projects before considering credit or dual-degree arrangements.
十 來源與更新界限
10 Sources and Update Boundaries
來源為學校官方課程、計畫及研究頁面。正式招生或合作前應重新確認當期開課、名額、資格與費用；研究資源不能自動推定對外開放。
Sources are official course, program and research pages. Reconfirm course availability, places, eligibility and costs before enrollment or partnership. Research resources do not automatically establish external access.
[1] UT Austin semiconductor master’s
[2] UT Austin online graduate certificate
[3] UT Austin ASIC workforce teaching
https://ece.utexas.edu/news/texas-ece-leads-semiconductor-workforce-development-integrated-circuit-design
[4] UT ACC TIE training partnership
[5] Texas A&M WAVE-CHIP
[6] Texas A&M manufacturing certificate
https://engineering.tamu.edu/electrical/academics/degrees/graduate/semiconductor-certificate.html
[7] Texas A&M semiconductor safety certificate
https://catalog.tamu.edu/graduate/colleges-schools-interdisciplinary/engineering/chemical/safety-semiconductor-processing-certificate/
[8] UT Dallas 2026 semiconductor certificate
https://catalog.utdallas.edu/2026/graduate/programs/ecs/materials-science
[9] UNT manufacturing engineering certificate
https://www.unt.edu/academics/programs/semiconductor-manufacturing-engineering-gac.html
[10] UNT device processing microcredential
https://digitalstrategy.unt.edu/microcredentials/semiconductor-device-processing.html
[11] UH engineering and manufacturing certificate
https://www.me.uh.edu/graduate/certificate-programs/certificate-semiconductor-engineering-manufacturing
[12] UT Arlington FPGA SoC certificate
https://catalog.uta.edu/engineering/computer/graduate/fpga-system-chip-design-cert/
[13] UT Arlington photonics electronics courses
https://www.uta.edu/academics/schools-colleges/engineering/academics/departments/electrical/students/ug-tracks/photonics-and-electronics-track
[14] Texas Tech 3DHI master’s pathway
https://www.depts.ttu.edu/ece/research/research_topics/3DHI.php
[15] ACC STARS curriculum and partners
Semiconductor Technician Advanced Rapid Start (STARS) Program Matrix
[16] ACC student training pathways
[17] UT Austin power semiconductor devices and packaging
https://spec.ece.utexas.edu/psdp